This product is dimensionally stable and has low shrinkage upon cure. The system features electrical insulation properties, including a volume resistivity exceeding 1,015 ohm-cm, a dielectric constant of 2.91 at 1 KHz, and a dissipation factor of 0.009 at 1KHz.
This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has an unlimited working life at room temperature.
EP13LTE is a one-part epoxy for structural bonding applications. It cures readily in one to two hours at 300°-350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates, such as metals, glass, composites, ceramics, and plastics.
Master Bond EP41S-F is a two-part epoxy for bonding, sealing, coating, and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and electrical insulation properties. This versatile system is easy to handle and has a forgiving 100:25 mix ratio by weight.
Formulated for use in thermal management applications, this two-component epoxy contains a thermally conductive filler with very fine particle sizes. This low-outgassing, NASA-certified system can be used for bonding, coating, sealing, and encapsulating for the aerospace, electronic, optical, and OEM industries.
Master Bond EP17HT-100 is a single-part epoxy system that is designed to cure in 60-90 minutes at 200°-220°F. Cures can be accelerated at higher temperatures.
