Company: Master Bond Inc.

Product: EP3HTSDA-1

Description: This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has an unlimited working life at room temperature. For storage, simple refrigeration is fine. This die attach epoxy dispenses smoothly and easily without any “tailing.” It is well-suited for automatic dispensing equipment and can be applied to a defined area without flowing. After curing, it has die strength. It has dimensional stability and can withstand thermal cycling and shock. The temperature range extends from minus 80° - 400°F. It bonds well to metals, ceramics, silicon dies, and many other substrates.