Master Bond Inc.: Epoxy Resin System
Company: Master Bond Inc.
Description: This product is dimensionally stable and has low shrinkage upon cure. The system features electrical insulation properties, including a volume resistivity exceeding 1,015 ohm-cm, a dielectric constant of 2.91 at 1 KHz, and a dissipation factor of 0.009 at 1KHz. The epoxy has a 1-to-2 mix ratio by weight with a moderate mixed viscosity of 7,000-11,000 cps and good flow properties. It requires an elevated temperature cure at 250-300°F in four to six hours. EP110F8-5 has a pot life of two to three days at room temperature, according to the company.
Contact: 201-343-8983; www.masterbond.com;