Company: Master Bond Inc.
Description: Formulated for use in thermal management applications, this two-component epoxy contains a thermally conductive filler with very fine particle sizes. This low-outgassing, NASA-certified system can be used for bonding, coating, sealing, and encapsulating for the aerospace, electronic, optical, and OEM industries. It features a low viscosity with excellent flow properties, making it well suited for coating and potting applications. As a two-part system, it requires a 10:1 mix ratio by weight. Color-coding facilitates can mix with Part A being gray and Part B being clear.
Contact: 201-343-8983; www.masterbond.com;