The Comfortmaker PAM3 air conditioning unit and PHM3 heat pump are designed for manufactured housing applications. Both units use R-22 and offer 13 SEER efficiency. In addition, the PHM3 has
The Spectroline® Marksman™ ultrasonic diagnostic tool converts and amplifies ultrasonic sound to sound audible to humans. It allows service techs to easily hear sounds that signify problems, such as compressed
HVAC Solution Steam Program version 3.2 is a visual tool created for designing and modeling HVAC steam systems using intelligent objects. This Windows®-based drag-and-drop program supports compiling of equipment schedules
An easy-to-install secondary safety switch is available for the 20 Plus condensate pump. The pump has a built-in safety switch that is integrated into the unit. The new switch is
The Pocket Tech Pro with Pocket Tech software is a portable service tool that provides techs with information to help diagnose equipment problems, perform required service, and improve rooftop unit
A Simple Object Access Protocol (SOAP) Web service interface is available for EService, a mobile dispatch application for field service organizations. SOAP is a message-based protocol based on eXtensible Markup
The TotalAire™ MSP® dehumidifiers are designed for installation in grocery stores. The refrigeration-based dehumidifiers incorporate MSP Technology's heat exchanger modules, creating a hybrid unit that delivers air between 44° and
The Riga-Vâ„¢ air filter provides high-efficiency rigid filtration performance. The V-pleat configuration produces optimized performance and offers superior dust loading and airflow characteristics, the company says. Available in three efficiencies
An eight-page color brochure features the Mills family of sectional water tube boiler/burner units. The publication provides a detailed explanation, schematic illustrations, and photographs of the boilers, which come in
The 7620, 7612, and 7610 professional infrared (IR) thermometers feature SoC (System-on-a-Chip) technology, which allows the complete IR design to be incorporated inside a single chip, creating compact, lightweight units.