The Copper Alliance and Optimized Thermal Systems Inc. (OTS) announced that newly developed MicroGroove™ correlations will be implemented in CoilDesigner software, a proprietary heat exchanger simulation and design optimization tool developed by the Center for Environmental Energy Engineering (CEEE) at the University of Maryland. Airside and refrigerant-side correlations were developed through research at the Shanghai Jiao Tong University (SJTU). Development costs for MicroGroove coils can be lowered using CoilDesigner and products can be brought to market quickly. For information on CoilDesigner, visit www.ceee.umd.edu.
CoilDesigner Now Includes MicroGroove
Coil Design Software Reduces Development Costs
June 1, 2015