Armstrong Fluid Technology is unveiling its Generation Three Design Envelope pumps featuring 33 advanced energy saving models ranging in sizes from 1 to 75 hp. “The Design Envelope technology integrates the latest selection, control, and hydronic tools into heat-transfer solutions that naturally accommodate changes in building design and demand to ensure that system performance is at an optimum at any given time,” according to Lex van der Weerd, CEO of Armstrong Fluid Technology. “It is a more intelligent method of ensuring better HVAC equipment efficiency and achieving the lowest lifecycle cost.”

Booth # 1819
http://armstrongfluidtechnology.com