PEARL RIVER, N.Y. — Hudson Technologies Inc. opened a new 60,000-square-foot warehouse and reclamation facility in Champaign, Ill. The new facility complements Hudson’s existing 50,000-square-foot facility and will increase the company’s production capacity and processing efficiency for the reclamation of refrigerants.

“Hudson is an established leader in the reclamation industry, and to maintain and strengthen that leadership position we needed to increase our reclamation capacity in preparation for what is estimated to be a nearly four-fold increase in the reclamation of HCFC [hydrochlorofluorocarbons] refrigerants,” said Kevin Zugibe, chairman and CEO of Hudson Technologies.

According to Zugibe, the upcoming Environmental Protection Agency (EPA) phaseout of HCFCs will reduce the supply of new HCFC refrigerants by more than 60 percent from current levels. As a result, the EPA has estimated that as of Jan. 1, 2010 the demand for HCFC refrigerants needed to service existing equipment will exceed the available supply of new HCFC refrigerants by approximately 20 percent. It is expected that this supply gap will be filled with reclaimed and recycled refrigerant.

“Earlier this year we announced the introduction of the Hudson Platinum Program as an all inclusive reclamation offering specifically designed to assist customers in maximizing the recovery and reclamation of HCFC refrigerants,” noted Zugibe. “In preparation for the phaseout, we reviewed our operations and refined our manufacturing processes to recognize greater efficiencies on a ‘per pound’ basis, and with our proven reclamation infrastructure and production model, we were able to ramp up the new facility quickly and with minimal capital investment. With this new facility we have increased our capacity and have taken a critical step towards addressing the sweeping changes soon to impact our industry and the anticipated increase in reclamation activity that we believe those changes will bring in the coming years.”

For more information, visit www.hudsontech.com.

Publication date: 07/06/2009