Engineering Centers in India, North America, Europe will Support Global HVAC Innovation
TOKYO — Toshiba Corp. and United Technologies Corp. (UTC) announced plans to establish engineering centers in India, North America, and Europe to support global innovation for HVAC products. This cooperation is the first to result from the companies’ recent agreement to further strengthen their strategic collaboration through their joint venture, Toshiba Carrier Corp. (TCC).
The plan will leverage Carrier’s global footprint with new engineering centers expected in India, North America, and Europe within the next five years. The two companies also agreed on plans to localize manufacturing in the same regions in a similar time frame.