Monday, Jan. 26, 2004: Emerson Holds Extravaganza Prior To Expo Opening
Attendees were entertained with comedy shows, gambling, magician acts, and more at Hollywood Pictures Backlot, located in the theme park next to Disneyland. Racing legend Rusty Wallace was also present, signing autographs. He will have the same task on opening day of the AHR Expo, signing autographs at Emerson Climate Technologies' booth (#4510) from 10 a.m. until noon.
Introduced at last year's expo in Chicago, the UltraTech Home Series represents a new concept in residential heating and cooling technology, noted Bettcher. It is designed to provide a grouping of the most advanced, energy-efficient products that can either stand alone as an individual application, or be combined for a more complete system solution, he said. According to the company, the series features several first-to-market innovations â€“ from two-stage scroll compressors and advanced furnace ignition controls to "forward-thinking diagnostics," all designed to reduce energy usage, enhance comport, and improve serviceability.
"Contractors are actively promoting the benefits of UltraTech products to homeowners, and several major OEMs are applying our technology in their designs for high-end residential products," Bettcher continued. "Everyone is realizing that UltraTech is important in reaching the higher efficiency and comfort expected by today's homeowners, as well s supporting new system innovation and giving contractors a way up to sell and improve their service business."
At the expo, Emerson plans to introduce its UltraTech Thermostat and the EK Filter Drier. Regarding the thermostat, Emerson said it will provide humidity control, eliminating the need for a separate humidistat.
Also at the expo, the company said it will highlight its efforts to help the industry prepare for the 2010 R-22 phase-out. The booth will feature numerous technologies designed to provide contractors and OEMs with "the most efficient and environmentally safe solutions available."
Publication date: 01/26/2004